1. 2. 3. material content data sheet sales product name bsz0902nsi issued 19. february 2015 ma# MA001336210 package pg-tsdson-8-26 weight* 36.49 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.419 1.15 1.15 11475 11475 leadframe inorganic material phosphorus 7723-14-0 0.002 0.01 67 non noble metal zinc 7440-66-6 0.010 0.03 270 non noble metal iron 7439-89-6 0.197 0.54 5392 non noble metal copper 7440-50-8 7.988 21.89 22.47 218925 224654 wire noble metal gold 7440-57-5 0.029 0.08 0.08 801 801 encapsulation organic material carbon black 1333-86-4 0.037 0.10 1023 plastics epoxy resin - 1.922 5.27 52664 inorganic material silicondioxide 60676-86-0 16.698 45.77 51.14 457612 511299 leadfinish non noble metal tin 7440-31-5 0.395 1.08 1.08 10833 10833 plating noble metal silver 7440-22-4 0.020 0.06 0.06 557 557 solder noble metal silver 7440-22-4 0.016 0.04 435 non noble metal tin 7440-31-5 0.013 0.03 348 non noble metal lead 7439-92-1 0.607 1.66 1.73 16631 17414 heatspreader inorganic material phosphorus 7723-14-0 0.001 0.00 32 non noble metal zinc 7440-66-6 0.005 0.01 129 non noble metal iron 7439-89-6 0.094 0.26 2576 non noble metal copper 7440-50-8 3.816 10.46 10.73 104577 107314 heat sink clip inorganic material phosphorus 7723-14-0 0.001 0.00 35 non noble metal zinc 7440-66-6 0.005 0.01 139 non noble metal iron 7439-89-6 0.101 0.28 2776 non noble metal copper 7440-50-8 4.112 11.27 11.56 112703 115653 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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